Printed circuit board and exterior casing design
Regarding the outer casing, we can implement thermal measures and check for electromechanical interference in collaboration with our business partner!
Our company is engaged in the "Printed Circuit Board and Enclosure Design" business. The core team members have many years of experience in the field, allowing us to respond broadly from high-density, high-layer-count boards used in server equipment to advanced information terminal boards and boards integrated into smart glasses. Regarding enclosures, we can conduct thermal management and electromechanical interference checks in collaboration with our partner companies. 【Main Tools】 ■ First Corporation START ■ Zuken Corporation Design Force ■ Cadence Allegro ■ Mentor, a Siemens Business PADS *For more details, please refer to the related links or feel free to contact us.
- 企業：アジアスニーズウエイ
- 価格：Other
